DocumentCode :
1398725
Title :
Measuring the Manufacturing Yield for Processes With Multiple Manufacturing Lines
Author :
Tai, Y.T. ; Pearn, W.L. ; Kao, Chun-Min
Author_Institution :
Dept. of Inf. Manage., Kainan Univ., Taoyuan, Taiwan
Volume :
25
Issue :
2
fYear :
2012
fDate :
5/1/2012 12:00:00 AM
Firstpage :
284
Lastpage :
290
Abstract :
Process yield is the most common criterion used in the semiconductor manufacturing industry for measuring process performance. In the globally competitive manufacturing environment, photolithography processes involving multiple manufacturing lines are quite common in the Science-Based Industrial Park in Hsinchu, Taiwan, due to economic scale considerations. In this paper, we develop an effective method for measuring the manufacturing yield for photolithography processes with multiple manufacturing lines. Exact distribution of the estimated measure is analytically intractable. We obtain a rather accurate approximation to the distribution. In addition, we tabulate the lower conference bounds based on the obtained approximated distributions for the convenience of industry applications. We also develop a decision-making method for process precision testing to determine whether a process meets the process yield requirement preset in the factory. For illustration purposes, an application example is included.
Keywords :
approximation theory; decision making; integrated circuit yield; photolithography; semiconductor device manufacture; semiconductor device measurement; decision-making method; distribution approximation; industry application; manufacturing line; manufacturing yield measurement; photolithography process; process performance measurement; process precision testing; process yield; semiconductor manufacturing industry; Approximation methods; Indexes; Integrated circuits; Lithography; Process control; Semiconductor device measurement; Capability index; lower confidence bound; multiple manufacturing lines; process yield;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2011.2179568
Filename :
6104171
Link To Document :
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