DocumentCode :
139877
Title :
On verification of splines based intraoperative reconstruction of cardiac anatomy: Model research
Author :
Yifan Fu ; Jian Wu
Author_Institution :
Grad. Sch. at Shenzhen, Tsinghua Univ., Shenzhen, China
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
2436
Lastpage :
2439
Abstract :
Three-dimensional (3D) endocardium visualization plays an extremely important role in localization and ablation of target areas and can improve the cure rate in computer-aided cardiac surgery. In this paper, we discuss how to reconstruct and update the corresponding endocardium surface model quickly and accurately based on the sparse point cloud that is collected dynamically on the left atrial intima. Firstly, we construct a specific mesh model, and then collect spatial points, and carried out the mesh grid approximation based on Thin Plate Splines (TPS) intra-operatively, finally, we obtained an approximate target shape after Taubin-based smooth. Experiments on four left atriums´ (LA) CT Angiographies (CTA) demonstrated that the reconstructed surfaces can well fit to the target shape, the distance error of surface between the reconstructed and targets can meet clinical requirements, and the deformation time can also meet the need of real-time update. The results showed that our proposed method is robust, fast and flexible to implement.
Keywords :
angiocardiography; computerised tomography; medical computing; splines (mathematics); surgery; 3D endocardium visualization; CT angiographies; CTA; Taubin-based smooth; cardiac anatomy; computer-aided cardiac surgery; endocardium surface model; left atrial intima; left atriums; mesh grid approximation; reconstructed surfaces; sparse point cloud; splines based intraoperative reconstruction; thin plate splines; Approximation methods; Deformable models; Image reconstruction; Shape; Surface reconstruction; Surgery; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944114
Filename :
6944114
Link To Document :
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