Title :
Miniaturised 45° power divider using three-dimensional MMIC technology
Author :
Hayashi, H. ; Piernas, B. ; Nishikawa, K. ; Nakagawa, T.
Author_Institution :
NTT Network Innovation Labs., Kanagawa, Japan
fDate :
10/12/2000 12:00:00 AM
Abstract :
A miniaturised 45° power divider using three-dimensional MMIC technology is described. The divider comprises stacked thin-film microstrip lines that sandwich a ground plane between them. It has an area of only 0.43 mm2, and it exhibits a coupling of 4.5±0.2 dB and a phase difference of 45±1° from 28 to 33 GHz
Keywords :
MMIC; microstrip components; millimetre wave devices; power dividers; 28 to 33 GHz; 3D MMIC technology; 45 degree power divider; K-band; miniaturised power divider; sandwiched ground plane; stacked thin-film microstrip lines; three-dimensional MMIC technology;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20001189
