DocumentCode
1399765
Title
Surface passivation of GaAs MESFETs
Author
Charache, Greg W. ; Akram, S. ; Maby, Edward Wilfrid ; Bhat, I.B.
Author_Institution
Knolis Atomic Power Lab., Lockheed-Martin Corp., Schenectady, NY, USA
Volume
44
Issue
11
fYear
1997
fDate
11/1/1997 12:00:00 AM
Firstpage
1837
Lastpage
1842
Abstract
The metal semiconductor field effect transistor (MESFET) represents a more realistic test for “passivation” efficacy than conventional capacitor test structures due to its prototypical fabrication process. This paper evaluates Gallium-Arsenide (GaAs) surface passivation films utilizing the MESFET as a test vehicle. For this study, gate-to-drain leakage current, gate-to-drain breakdown voltage, complex impedance versus frequency, and low-frequency noise measurements are performed on MESFETs with various passivation films. The results indicate that a hydrogen plasma used to “pre-clean” the GaAs surface in conjunction with an in situ plasma-enhanced chemical vapor deposition (PECVD) Si3N4 passivation film yields the best performance. In contrast, atomic-layer-epitaxial ZnSe demonstrated inferior performance (even in comparison to PECVD Si3N4 passivation films that did not receive a hydrogen “pre-clean”)
Keywords
III-V semiconductors; Schottky gate field effect transistors; gallium arsenide; passivation; GaAs; GaAs MESFET; PECVD Si3N4 film; Si3N4; ZnSe; atomic-layer-epitaxial ZnSe film; breakdown voltage; complex impedance; hydrogen plasma pre-clean; leakage current; low-frequency noise; metal semiconductor field effect transistor; surface passivation; Capacitors; FETs; Gallium arsenide; Hydrogen; MESFETs; Passivation; Plasma chemistry; Plasma measurements; Semiconductor device testing; Semiconductor films;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.641350
Filename
641350
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