Title :
Backside optical measurements of picosecond internal gate delays in a flip-chip packaged silicon VLSI circuit
Author :
Heinrich, H.K. ; Pakdaman, N. ; Kent, D.S. ; Cropp, L.M.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
7/1/1991 12:00:00 AM
Abstract :
A report is presented of the backside optical measurements of internal gate propagation delays in a flip-chip mounted silicon integrated circuit. Both gate delays and risetimes agreed well with prior simulations. However, the measurements displayed additional features on the signals that were not seen in the simulations, such as feedforward through devices, signal over/undershoot, and circuit switching noise on the power supply.<>
Keywords :
VLSI; bipolar integrated circuits; delays; emitter-coupled logic; flip-chip devices; integrated circuit testing; logic testing; measurement by laser beam; ECL logic gate; Si; backside optical measurements; circuit switching noise; feedforward; flip chip packaged VLSI circuit; internal gate propagation delays; laser probe; power supply; risetimes; signal overshoot; signal undershoot; Circuit simulation; Integrated circuit measurements; Integrated circuit packaging; Integrated optics; Noise measurement; Photonic integrated circuits; Power measurement; Propagation delay; Silicon; Very large scale integration;
Journal_Title :
Photonics Technology Letters, IEEE
