• DocumentCode
    1402166
  • Title

    Productivity Improvement From Using Machine Buffers in Dual-Gripper Cluster Tools

  • Author

    Geismar, Neil ; Dawande, Milind ; Sriskandarajah, Chelliah

  • Author_Institution
    Mays Bus. Sch., Texas A&M Univ., College Station, TX, USA
  • Volume
    8
  • Issue
    1
  • fYear
    2011
  • Firstpage
    29
  • Lastpage
    41
  • Abstract
    Cluster tools (also referred to as robotic cells) are extensively used in semiconductor wafer fabrication. We consider the problem of scheduling operations in an m -machine cluster tool that produces identical parts (wafers). Each machine is equipped with a unit-capacity input buffer and a unit-capacity output buffer. The machines and buffers are served by a dual-gripper robot. Each wafer is processed on each of the m machines, and the objective is to find a cyclic sequence of robot moves that minimizes the long-run average time to produce a part or, equivalently, maximizes the throughput. We first obtain a tight upper bound on the optimal throughput and then use this bound to obtain an asymptotically optimal sequence under conditions that are common in practice. Next, we quantify the improvement in productivity that can be realized from the use of unit-capacity input and output buffers at the machines. Finally, we illustrate our analysis on cluster tools with realistic parameters, based on our work with a Dallas-based semiconductor equipment manufacturer.
  • Keywords
    grippers; productivity; scheduling; semiconductor industry; dual-gripper cluster tools; machine buffers; productivity improvement; scheduling; semiconductor equipment manufacturer; semiconductor wafer fabrication; Chemical vapor deposition; Fabrication; Job shop scheduling; Manufacturing industries; Manufacturing processes; Planarization; Productivity; Semiconductor device manufacture; Service robots; Throughput; Cluster tools; cyclic solutions; dual-gripper robots; manufacturing;
  • fLanguage
    English
  • Journal_Title
    Automation Science and Engineering, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1545-5955
  • Type

    jour

  • DOI
    10.1109/TASE.2009.2039567
  • Filename
    5405065