Title :
Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling
Author :
Pillai, Edward R.
Author_Institution :
Div. of Microelectron., IBM Corp., Hopewell Junction, NY, USA
fDate :
10/1/1997 12:00:00 AM
Abstract :
Large-scale crosstalk at vias and poor via electrical performance are major drawbacks in state-of-the-art high-frequency multilayer first- or second-level integrated-circuit/monolithic-microwave integrated-circuit (IC/MMIC) packages. The coax via design modeled in this paper breaks new ground in achieving more than 30-dB ultrawide-band crosstalk reduction and providing an enhanced impedance match
Keywords :
MMIC; crosstalk; finite difference time-domain analysis; impedance matching; integrated circuit packaging; method of moments; FDTD model; IC; MMIC; MoM model; coax via; crosstalk; high-frequency multilayer package; impedance matching; Coaxial components; Crosstalk; Finite difference methods; Impedance; Integrated circuit modeling; Integrated circuit packaging; Microstrip; Nonhomogeneous media; Stripline; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
