DocumentCode :
1403426
Title :
Nickel–chromium alloy piezoresistive pressure sensor using eutectic bonding
Author :
Lidong Du ; Zhan Zhao ; Li Xiao ; Zhen Fang ; Qing Tian ; Xuejin Sun ; Xiaolei Wang
Author_Institution :
State Key Lab. of Transducer Technol., Inst. of Electron., Beijing, China
Volume :
7
Issue :
12
fYear :
2012
fDate :
12/1/2012 12:00:00 AM
Firstpage :
1184
Lastpage :
1188
Abstract :
A nickel-chromium (Ni-Cr) piezoresistive pressure sensor is presented, which has the advantages of low-cost and easy fabrication processes. In the designed sensor, Ni-Cr alloy (80:20-wt-), which can be fabricated using simple processes, is used as the strain-detecting material with a smaller but acceptable gauge factor. Eutectic-bonding technology, based on silver-tin (Ag-Sn) alloy, which contains 3.5-wt- Ag and has 20--m thickness, is used as an alternative and easy bonding choice to complete the vacuum package. Normally, Ag-Sn alloy is mostly obtained by the electrochemical deposition method. However, here the Ag-Sn solder film is directly used as a bonding material. It reduces the fabrication difficulty of eutectic bonding of the proposed pressure sensor. By studying the processes of annealing of Ni-Cr fabrication and eutectic bonding with Ag-Sn, the authors complete the alloy piezoresistive atmosphere pressure sensor. Bonding quality is evaluated by inspection through the deflection of a diaphragm of silicon with more than 95- of the area successfully bonded. The pressure-voltage characteristic test results suggest a precision within 0.3- in square fitting. The temperature coefficient offset is 620-ppm/(-C free space optic (FSO)).
Keywords :
annealing; bonding processes; chromium alloys; eutectic alloys; inspection; nickel alloys; piezoresistive devices; pressure sensors; silver alloys; solders; tin alloys; Ag-Sn; Ni-Cr; annealing processes; bonding material; electrochemical deposition method; eutectic bonding; fabrication processes; gauge factor; inspection; nickel-chromium alloy piezoresistive atmosphere pressure sensor; pressure-voltage characteristic test; silicon diaphragm; silver-tin alloy; solder film; square fitting; strain-detecting material; temperature coefficient offset;
fLanguage :
English
Journal_Title :
Micro & Nano Letters, IET
Publisher :
iet
ISSN :
1750-0443
Type :
jour
DOI :
10.1049/mnl.2012.0552
Filename :
6419589
Link To Document :
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