Title :
Design of Complex Structured Monolithic Heat Sinks for Enhanced Air Cooling
Author :
Krishnan, Shankar ; Hernon, Domhnaill ; Hodes, Marc ; Mullins, John ; Lyons, Alan M.
Author_Institution :
Bell Labs., Alcatel-Lucent, Dublin, Ireland
Abstract :
The design and characterization of monolithic heat sinks, which can take the form of complex structures, is reported. The designs were conceived to augment heat transport for enhanced air cooling by exploiting clearly identified physical mechanisms, i.e., by streaming the flow through a 2-D array of polygonal ducts, by introducing flow-obstacle-induced local mixing, and by exploiting hydrodynamic instabilities to sustain flow unsteadiness. Fabrication of these unconventional designs was achieved by 3-D printing plastic patterns and converting them into monolithic copper structures by investment casting. A direct simulation approach aided by analytical solutions and experimental validation was undertaken to quantify fluid flow and heat transfer parameters. This paper concludes by quantifying the performance enhancement of the proposed heat sink geometries relative to a conventional longitudinally finned heat sink. On an equal pumping power basis, finned foam and slotted hexagonal heat sinks outperform conventional parallel plate finned heat sinks. On the other hand, the parallel plate heat sinks are better for pressure drop less than 20 Pa and slotted honeycombs are better for higher pressure drops (>;20 Pa).
Keywords :
cooling; heat sinks; 2D array; 3D printing plastic pattern; complex structures; direct simulation; enhanced air cooling; finned foam; flow obstacle induced local mixing; flow unsteadiness; fluid flow; heat sink geometry; heat transfer parameter; heat transport; hydrodynamic instability; investment casting; monolithic copper structure; parallel plate finned heat sinks; polygonal ducts; pressure drop; pumping power basis; slotted hexagonal heat sinks; slotted honeycombs; structured monolithic heat sinks; Casting; Ducts; Heat sinks; Heat transfer; Resistance; Resistance heating; Convective heat transfer; electronics cooling; heat sinks;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2011.2175448