Title :
Packaging design of microsystems and meso-scale devices
Author_Institution :
Dept. of Mech. & Aerosp. Eng., San Jose State Univ., CA, USA
fDate :
11/1/2000 12:00:00 AM
Abstract :
This paper will present an overview on electromechanical packaging of microelectromechanical systems (MEMS) and microsystems such as microsensors, actuators, and fluidics. Technical problems and major issues related to packaging design will also be presented and discussed.
Keywords :
micromechanical devices; semiconductor device packaging; electromechanical packaging; meso-scale devices; microactuators; microelectromechanical systems; microfluidics; microsensors; microsystems; packaging design; Actuators; Costs; Electromechanical sensors; Fabrication; Fluidics; Microelectromechanical systems; Micromechanical devices; Microsensors; Packaging; Signal processing;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.883747
