DocumentCode
140678
Title
Dual logic and dual neural basis for reciprocal social interaction in eye contact
Author
Lee, Ray F.
Author_Institution
Princeton Univ., Princeton, NJ, USA
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
4912
Lastpage
4915
Abstract
Dyadic brain interactions during eye contact engage multiple processes and recruit multiple networks. To fully characterize these concurrent activities, it´s essential to establish the neural basis for reciprocal social interaction. So far most approaches in this pursuit suffered from the limitations in either insufficient dyadic test instruments or entwined reciprocal and non-reciprocal cerebral responses. To address these two challenges, this study not only employed a dual-head coil to directly acquire dyadic fMRI data, but also developed a dual logic to deductively untwine the reciprocal social interactive state and non-reciprocal affective state in cerebral responses. As results, a data-driven neural basis for visual reciprocal interaction is derived, which mainly consists of imitation-empathy network and mentalizing network to facilitate the exogenous and endogenous dual processes. Applications of the neural basis in extracting dyadic network synchronizations are exemplified. In addition, the dual logic formulated emergence of the endogenous process and predicted the default-mode network.
Keywords
biomedical MRI; brain; eye; medical image processing; neurophysiology; cerebral response; data-driven neural basis; default-mode network; dual logic basis; dual neural basis; dual-head coil; dyadic brain interactions; dyadic fMRI data; dyadic network synchronization; endogenous dual process; exogenous dual process; eye contact; imitation-empathy network; nonreciprocal affective state; reciprocal social interaction; reciprocal social interactive state; visual reciprocal interaction; Coils; Couplings; Educational institutions; Instruments; Integrated circuits; Materials; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6944725
Filename
6944725
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