Title :
Modeling and optimizing the costs of electronic systems
Author :
Scheffler, Michael ; Ammann, Daniel ; Thiel, Andreas ; Habiger, Claus ; Troster, Gerhard
Author_Institution :
Electron. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
Abstract :
Today´s high-density packaging technologies make early attention to most factors essential in the design of successful products. A process-oriented, scalable cost-modeling tool, the Modular Optimization Environment (MOE), enables a continuous cost-quality-performance trade-off analysis throughout the design and manufacturing process
Keywords :
electronic engineering computing; electronics industry; packaging; Modular Optimization Environment; cost-quality-performance; design and manufacturing process; high-density packaging; process-oriented; scalable cost-modeling; Cost function; Design optimization; Economic forecasting; Environmental economics; Manufacturing processes; Power generation economics; Process design; Product design; Production; Testing;
Journal_Title :
Design & Test of Computers, IEEE
