Title :
Solder thickness variation with respect to soldering parameters
Author :
Lin, Kwang-Lung ; Yao, Steven
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fDate :
12/1/2000 12:00:00 AM
Abstract :
This study investigated the growth behavior of solder interconnect on solder bonding pad. The solder thickness was investigated with respect to parameters including bonding pad area, reflow temperature, solder paste volume, loading, and die size (metallization area). Solder thickness was found to have a maximum value with respect to the ratio of solder paste volume to pad size. Loading and the reflow temperature showed no effect on solder thickness. An enlargement in metallization area reduces the solder thickness, while greater solder paste volume increases the solder thickness
Keywords :
integrated circuit packaging; lead bonding; reflow soldering; bonding pad area; die size; growth behavior; loading; metallization area; reflow temperature; solder paste volume; solder thickness variation; soldering parameters; Bonding; Furnaces; Materials science and technology; Metallization; Photodiodes; Rectifiers; Shape; Soldering; Substrates; Temperature;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.888850
