Title :
Long-Term Thermal Overstressing of Computers
Author :
Gray, Kirk A. ; Pecht, Michael
Abstract :
Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems´ reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.
Keywords :
DP industry; computer equipment testing; computer testing; cost reduction; design engineering; reliability; thermal stresses; cost reduction; cost savings; design specification; high steady state temperature; system reliability testing; thermal cycling; thermal overstressing; Computers; Cost benefit analysis; Failure analysis; Hardware; Reliability engineering; Temperature measurement; computer; cost savings; design and test; high temperature; long-term thermal overstressing; reliability;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2011.127