DocumentCode :
1416086
Title :
Long-Term Thermal Overstressing of Computers
Author :
Gray, Kirk A. ; Pecht, Michael
Volume :
28
Issue :
6
fYear :
2011
Firstpage :
58
Lastpage :
65
Abstract :
Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems´ reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.
Keywords :
DP industry; computer equipment testing; computer testing; cost reduction; design engineering; reliability; thermal stresses; cost reduction; cost savings; design specification; high steady state temperature; system reliability testing; thermal cycling; thermal overstressing; Computers; Cost benefit analysis; Failure analysis; Hardware; Reliability engineering; Temperature measurement; computer; cost savings; design and test; high temperature; long-term thermal overstressing; reliability;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2011.127
Filename :
6123681
Link To Document :
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