Title :
Modular, Multi-Function Digital-RF Receiver Systems
Author :
Gupta, Deepnarayan ; Kirichenko, Dmitri E. ; Dotsenko, Vladimir V. ; Miller, Robert ; Sarwana, Saad ; Talalaevskii, Andrei ; Delmas, Jean ; Webber, Robert J. ; Govorkov, Sergei ; Kirichenko, Alexander F. ; Vernik, Igor V. ; Tang, Jia
Author_Institution :
HYPRES, Inc., Elmsford, NY, USA
fDate :
6/1/2011 12:00:00 AM
Abstract :
Superconductor digital receiver systems of increasing functionality, modularity and user-friendliness have been developed. The modular design methodology ensures that within its input-output and heat load capacity, the system can be reconfigured to perform a different function by changing the chip module and by reprogramming FPGA-based digital signal processors. One of the systems (ADR-004), originally equipped with a 10 × 10 mm2 channelizing receiver chip for signals intelligence application, was reconfigured with a 5 × 5 mm2 1.1-GHz bandpass ADC chip to perform world´s first multi-net Link-16 demonstration at a U.S. Navy facility. Substantial improvements in system integration have been obtained in each successive generation of digital-RF receiver systems. The latest (third) generation system (ADR-005), hosting a 5 × 5 mm2 7.5-GHz bandpass ADC chip and an FPGA channelizer, successfully repeated the over-the-air SATCOM demonstration performed previously using a 1-cm2 single-chip bandpass digital receiver with an on-chip superconductor channelizer. This system ran error-free for over 12 hours with and without a low-noise amplifier. To our knowledge, this is the first time an X-band SATCOM receiver has been operated without analog amplification and down-conversion in a military application.
Keywords :
band-pass filters; digital radio; digital signal processing chips; field programmable gate arrays; low noise amplifiers; radio receivers; satellite communication; superconducting devices; FPGA channelizer; FPGA-based digital signal processors; SATCOM demonstration; X-band SATCOM receiver; analog amplification; bandpass ADC chip; channelizing receiver chip; chip module; down-conversion; heat load capacity; latest third generation system; low-noise amplifier; military application; modular design methodology; multifunction digital-RF receiver systems; multinet link-16 demonstration; on-chip superconductor channelizer; signals intelligence application; single-chip bandpass digital receiver; successive generation; superconductor digital receiver systems; system integration; Clocks; Heating; High temperature superconductors; Lead; Receivers; Superconducting integrated circuits; Superconducting transmission lines; Cryogenic electronics; digital radio; satellite communication; sigma-delta modulation;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2010.2095399