New topic session 2B: Co-design and reliability of power electronic modules — Current status and future challenges

Power electronics covers various disciplines, especially semiconductor, circuit design, thermal design (heat transfer, fluid flow), electromagnetics (EMI, Inductors, transformers), digital electronics, control theory, and materials science in the context of packaging and reliability engineering. It also covers a wide range of power (mW to MW), temperature (−55C to 275C), frequencies (DC to GHz) and dimensions (um to km). The global power electronics market is worth over $200Bn and is seeing significant growth in sectors such as aerospace, automotive and energy generation, transmission and distribution. This presentation will discuss the current status and future challenges in the design of power electronics components and systems. In particular co-design in terms of the modeling and analysis toolsets that enable power electronics designers to undertake thermal, electromagnetic and mechanical analysis of new power electronics components and systems, as well as the need for an holistic approach to designing such systems from the devices to convertors and drives in an integrated manner.