• DocumentCode
    1421725
  • Title

    Temperature dependent characterization of bipolar silicon power semiconductors-a new physical model validated by device-internal probing between 400-100 K

  • Author

    Schlögl, Andreas E. ; Mnatsakanov, Tigran T. ; Kuhn, Harald ; Schroder, Dierk

  • Author_Institution
    Infineon Technol. AG, Munich, Germany
  • Volume
    15
  • Issue
    6
  • fYear
    2000
  • fDate
    11/1/2000 12:00:00 AM
  • Firstpage
    1267
  • Lastpage
    1274
  • Abstract
    A new physical model for characterizing the temperature dependent operation of power semiconductor devices for network simulation purposes is presented. It is based on the application of a new continuity equation for describing the carrier transport in the low doped layer of power semiconductor structures. Modern results of carrier mobility description, particularly concerning electron hole scattering (EHS) are strictly taken into account even as temperature conditioned effective ionization of doping atoms. The model is validated by free carrier absorption (FCA) experiments at temperatures between 400-100 K. It could be shown that models based on standard continuity equations and standard mobility expressions are principally inconsistent
  • Keywords
    carrier density; carrier mobility; elemental semiconductors; ionisation; power semiconductor devices; semiconductor device models; silicon; thermal analysis; Si; bipolar silicon power semiconductors; carrier mobility description; carrier transport; continuity equation; doping atoms; electron hole scattering; free carrier absorption; internal probing; low doped layer; network simulation; physical model; power semiconductor structures; standard continuity equations; standard mobility expressions; temperature conditioned effective ionization; temperature dependent characterization; temperature dependent operation; Charge carrier processes; Electron mobility; Equations; Ionization; Power semiconductor devices; Scattering; Semiconductor device doping; Semiconductor process modeling; Silicon; Temperature dependence;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/63.892841
  • Filename
    892841