Editor´s statement

AN unintended error has occurred in the processing of the August 1998 issue of IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY — PART A: ADVANCED PACKAGING. This issue includes eight technical articles from the IEEE 6th Topical Meeting on the Electrical Performance of Electronic Packaging, EPEP´97, October 27–29, 1997, San Jose, CA. However, the origin of these articles is not recognized in the August issue. In order to remedy this error, the titles and authors of these articles are reprinted here together with the foreword for the special section and the biographies of the Guest Editors. The editorial office sincerely apologizes to the Guest Editors, Reviewers, and Authors of these articles.