DocumentCode
1421865
Title
[Back inside cover]
Volume
21
Issue
4
fYear
1998
Abstract
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/TCPMB.1998.7102335
Filename
7102335
Link To Document