DocumentCode
1421994
Title
[Back inside cover]
Volume
21
Issue
4
fYear
1998
Abstract
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher
ieee
ISSN
1083-4400
Type
jour
DOI
10.1109/TCPMC.1998.7102533
Filename
7102533
Link To Document