DocumentCode :
1425141
Title :
60-GHz Four-Element Phased-Array Transmit/Receive System-in-Package Using Phase Compensation Techniques in 65-nm Flip-Chip CMOS Process
Author :
Kuo, Jing-Lin ; Lu, Yi-Fong ; Huang, Ting-Yi ; Chang, Yi-Long ; Hsieh, Yi-Keng ; Peng, Pen-Jui ; Chang, I. -Chih ; Tsai, Tzung-Chuen ; Kun-Yao Kao ; Hsiung, Wei-Yuan ; Wang, James ; Hsu, Yungping Alvin ; Lin, Kun-You ; Lu, Hsin-Chia ; Lin, Yi-Cheng ; Lu,
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
60
Issue :
3
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
743
Lastpage :
756
Abstract :
AThe 60-GHz four-element phased-array transmit/receive (TX/RX) system-in-package antenna modules with phase-compensated techniques in 65-nm CMOS technology are presented. The design is based on the all-RF architecture with 4-bit RF switched LC phase shifters, phase compensated variable gain amplifier (VGA), 4:1 Wilkinson power combining/dividing network, variable-gain low-noise amplifier, power amplifier, 6-bit unary digital-to-analog converter, bias circuit, electrostatic discharge protection, and digital control interface (DCI). The 2 × 2 TX/RX phased arrays have been packaged with four antennas in low-temperature co-fired ceramic modules through flip-chip bonding and underfill process, and phased-array beam steering have been demonstrated. The entire beam-steering functions are digitally controllable, and individual registers are integrated at each front-end to enable beam steering through the DCI. The four-element TX array results in an output of 5 dBm per channel. The four-element RX array results in an average gain of 25 dB per channel. The four-element array consumes 400 mW in TX and 180 mW in RX and occupies an area of 3.74 mm2 in the TX integrated circuit (IC) and 4.18 mm2 in the RX IC. The beam-steering measurement results show acceptable agreement of the synthesized and measured array pattern.
Keywords :
CMOS analogue integrated circuits; antenna phased arrays; beam steering; ceramics; electrostatic discharge; flip-chip devices; integrated circuit bonding; multichip modules; phase shifters; power amplifiers; power combiners; power dividers; radiofrequency integrated circuits; receiving antennas; system-in-package; transmitting antennas; CMOS technology; DCI; RF switched LC phase shifters; RX system-in-package antenna modules; TX system-in-package antenna modules; VGA; Wilkinson power combining network; Wilkinson power dividing network; all-RF architecture; beam-steering functions; beam-steering measurement; bias circuit; digital control interface; electrostatic discharge protection; flip-chip CMOS process; flip-chip bonding; four-element RX array; four-element TX array; four-element phased-array receive system-in-package; four-element phased-array transmit system-in-package; frequency 60 GHz; front-end; integrated circuit; low-temperature co-fired ceramic modules; phase compensated variable gain amplifier; phase compensation techniques; phase-compensated techniques; phased arrays; phased-array beam steering; power amplifier; size 65 nm; unary digital-to-analog converter; underfill process; variable-gain low-noise amplifier; Digital control; Gain; Phase shifters; Phased arrays; Power dividers; Switches; Transmitters; 60 GHz; Beamforming; CMOS; flip-chip; phase-compensated techniques; phased array; system-in-package (SiP); variable gain amplifier (VGA); wireless communication;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2011.2176508
Filename :
6133313
Link To Document :
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