Title :
The Effect of Surface Chemistry on MEMS Stiction in an Ultralow-Humidity Environment
Author :
Sammoura, Firas ; Hancer, Mehmet ; Yang, Ken
Author_Institution :
MEMS/Sensors Div., Analog Devices, Wilmington, MA, USA
fDate :
4/1/2011 12:00:00 AM
Abstract :
The susceptibility of microelectromechanical systems (MEMS) devices for stiction, treated with two different antistiction coatings, is investigated in ambient and ultralow-humidity environmental conditions. Wafer-level testing with a pull-in/pull-out voltage technique and a current compliant source was used to detect stiction on capped and uncapped wafers. Historically, the devices coated with a phenyl siloxane coating and capped in a dry nitrogen environment failed due to stiction at the wafer level with pull-in/pull-out tests as well as the packaged parts during tap testing. Although the uncapped devices did not show stiction at ambient humidity using the pull-in/pull-out detection technique, successive drops in the pull-out voltage were detected as the conditions of the test control chamber became drier. The sensitivity of the stiction performance to environment conditions was eliminated when the MEMS devices were coated in a fluorinated silane coating. The results are explained in terms of wetting angle and surface chemistry behavior of the coatings, resulting in improved hydrophobicity, thus mitigating adhesive capillary forces.
Keywords :
hydrophobicity; micromechanical devices; surface chemistry; wetting; MEMS stiction; fluorinated silane coating; hydrophobicity; microelectromechanical systems; phenyl siloxane coating; pull-in/pull-out voltage technique; pull-out voltage; surface chemistry; susceptibility; ultralow-humidity environment; wafer-level testing; wetting angle; Coatings; Force; Humidity; Micromechanical devices; Nitrogen; Surface charging; Surface treatment; Hysteresis curve; microelectromechanical systems; self-assembled monolayers (SAMs); stiction; surface adhesion; surface charging; ultralow humidity;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2010.2100029