Title :
Application of digital PGA technology to K-band microcircuit and microwave subsystem packages
Author :
Liang, Hongwei ; Barnes, Heidi Langeberg ; Laskar, Joy ; Estreich, Don
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
12/1/2000 12:00:00 AM
Abstract :
We present for the first time a low-cost high-performance pin grid array (PGA) packaging technology for K-band microcircuit and microwave subsystem packaging. The first-generation package demonstrates a 20 dB return loss to 8 GHz, and the second-generation package improves the return loss to 25 dB from DC to 26.5 GHz. We apply a comprehensive analysis method, which facilitates the optimization of the radio-frequency transition into the package. It combines the time-domain reflectometry analysis and frequency-domain full-wave analysis and reduces the optimization time significantly. The theoretical analysis is verified with measurement in both frequency and time domains. The results demonstrate that the low-cost PGA can be a much more cost-effective microwave packaging solution than the traditional deep cavity metal packages
Keywords :
circuit optimisation; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; losses; microwave integrated circuits; multichip modules; 0 to 26.5 GHz; 20 dB; 25 dB; K-band microcircuit packages; K-band microwave subsystem package; RF transition optimisation; digital PGA technology; first-generation package; frequency-domain full-wave analysis; low-cost PGA packaging technology; pin grid array packaging; return loss; second-generation package; time-domain reflectometry analysis; Electronics packaging; Frequency domain analysis; Frequency measurement; K-band; Microwave antenna arrays; Microwave technology; Optimization methods; Radio frequency; Reflectometry; Time domain analysis;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
