Title :
Effect of Solidification Conditions on Partial Melt Processed Bi2212/Ag Round Wire
Author :
Nachtrab, W.T. ; Liu, X.T. ; Wong, T. ; Schwartz, J.
Author_Institution :
Supercon, Inc., Shrewsbury, MA, USA
fDate :
6/1/2011 12:00:00 AM
Abstract :
In this study, we report the effect of cooling from the peak temperature reached during partial melt processing on the critical current for a Bi2212/Ag wire. A single-stage cooling approach is compared to two-stage cooling. For two-stage cooling, the first stage cooling rate and the cooling rate transition temperature were varied to investigate the effects of undercooling on the solidification behavior of the 2212 phase. Two-stage cooling results in higher Ic compared to single-stage cooling, and the cooling rate transition temperature was found to have a greater effect on Ic than the initial cooling rate.
Keywords :
bismuth compounds; cooling; critical currents; high-temperature superconductors; melt processing; solidification; wires; Bi2212-Ag round wire; Bi2Sr2CaCu2O8; cooling rate transition temperature; critical current; initial cooling rate; partial melt processing; single-stage cooling; solidification conditions; two-stage cooling; undercooling on; Annealing; Conductors; Cooling; Melt processing; Microstructure; Silver; Wire; Bi2212/Ag round wire; high-temperature superconductors; partial melt processing; wires;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2010.2099194
