DocumentCode :
1433770
Title :
The effects of flux materials on the moisture sensitivity and reliability of flip-chip-on-board assemblies
Author :
Beddingfield, Craig ; Higgins, Leo M., III
Author_Institution :
Semicond. Products Sector, Motorola Inc., Austin, TX, USA
Volume :
21
Issue :
3
fYear :
1998
fDate :
7/1/1998 12:00:00 AM
Firstpage :
189
Lastpage :
195
Abstract :
This paper discusses the nonproprietary aspects of the work-in-progress regarding developments in flux materials to improve the moisture-induced stress sensitivity of flip chip plastic ball grid array devices. Studies addressing the moisture characterization and preconditioning, using JEDEC Level 3, of assemblies built with four proprietary fluxes and two alternative underfill materials will be presented. This report includes the evaluation of the weight loss during a simulated die attach reflow profile for each flux type using thermogravimetric analysis. Also, the underfill adhesion strength to the die surface after assembly, after moisture preconditioning and after 48 h of autoclave stressing will be discussed. The integrity of the solder joint corresponding to each flux type and measured using die pull techniques will also be presented. The effects of the experimental variables on underfill to die/substrate adhesion will also be reviewed using C-SAM imaging methods. Proprietary aspects of Motorola´s FC-PBGA materials and assembly technology will not be disclosed
Keywords :
adhesion; flip-chip devices; moisture; plastic packaging; reflow soldering; reliability; thermal analysis; C-SAM imaging; JEDEC Level 3; Motorola FC-PBGA; adhesion strength; autoclave stressing; die attach reflow profile; die pull technique; flip chip plastic ball grid array device; flip-chip-on-board assembly; flux material; moisture preconditioning; moisture sensitivity; reliability; solder joint; stress sensitivity; thermogravimetric analysis; underfill material; weight loss; Adhesives; Analytical models; Assembly; Electronics packaging; Flip chip; Microassembly; Moisture; Plastics; Soldering; Stress;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher :
ieee
ISSN :
1083-4400
Type :
jour
DOI :
10.1109/3476.720416
Filename :
720416
Link To Document :
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