Title :
Foreword thermal investigations of ICs and microstructures (THERMINIC)
Keywords :
Actuators; Circuit testing; Components, packaging, and manufacturing technology; Conferences; Electronic packaging thermal management; Integrated circuit modeling; Integrated circuit packaging; Microstructure; System testing; Temperature measurement;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
DOI :
10.1109/TCPMA.1998.725201
