DocumentCode :
1443783
Title :
Hot hole stress induced leakage current (SILC) transient in tunnel oxides
Author :
Wang, Tahui ; Zous, Nian-Kai ; Lai, Jia-Long ; Huang, Chimoon
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
19
Issue :
11
fYear :
1998
Firstpage :
411
Lastpage :
413
Abstract :
The mechanisms and transient characteristics of hot hole stress induced leakage current (SILC) in tunnel oxides are investigated. Positive oxide charge assisted tunneling is found to be a dominant SILC mechanism in a hot hole stressed device. The SILC transient is attributed to oxide hole detrapping and thus annihilation of positive charge assisted tunneling centers. Our characterization shows that the leakage current transient in a 100-/spl Aring/ oxide obeys a power law time dependence f/sup -n/ with the power factor n significantly less than one. An analytical model accounting for the observed time dependence is proposed.
Keywords :
MOSFET; hot carriers; leakage currents; semiconductor device measurement; semiconductor device models; semiconductor device reliability; transients; tunnelling; 100 angstrom; MOSFET; analytical model; hot hole stress induced leakage current transient; oxide hole detrapping; positive charge assisted tunneling center annihilation; positive oxide charge assisted tunneling; power factor; power law time dependence; reliability; transient characteristics; tunnel oxides; Area measurement; Charge measurement; Current measurement; EPROM; Hot carriers; Leakage current; MOSFET circuits; Stress measurement; Thermal stresses; Tunneling;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.728896
Filename :
728896
Link To Document :
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