DocumentCode :
1443790
Title :
Scalable PD/SOI CMOS with floating bodies
Author :
Fossum, Jerry G. ; Pelella, Mario M. ; Krishnan, Srinath
Author_Institution :
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
Volume :
19
Issue :
11
fYear :
1998
Firstpage :
414
Lastpage :
416
Abstract :
An insightful analysis of the floating-body (FB) effect on off-state current (I/sub off/) in PD/SOI MOSFETs is done based on simulations calibrated to a published scaled SOI CMOS technology (Chau et al., 1997). In contrast to the conclusion drawn by Chau, the simulations reveal that proven, easily integrated processes for enhancing carrier recombination in the source/drain junction region, in conjunction with the normal elevated chip temperature of operation, can effectively suppress the FB-induced increase of I/sub off/, thus enabling exploitation of the unique benefits of scaled PD/SOI CMOS circuits.
Keywords :
CMOS integrated circuits; MOSFET; SPICE; circuit simulation; semiconductor device models; silicon-on-insulator; SOI MOSFET; SOISPICE; carrier recombination enhancement; floating bodies; floating-body effect; integrated processes; off-state current; scalable partially depleted/SOI CMOS; scaled SOI CMOS technology; simulation; source/drain junction region; subthreshold I-V characteristics; Analytical models; CMOS logic circuits; CMOS process; CMOS technology; Circuit simulation; MOSFET circuits; Predictive models; Scalability; Temperature; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.728897
Filename :
728897
Link To Document :
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