DocumentCode
1447597
Title
Chipmakers bet on a stacked deck
Author
Corley, Anne-Marie
Volume
47
Issue
4
fYear
2010
fDate
4/1/2010 12:00:00 AM
Firstpage
14
Lastpage
14
Abstract
Imagine that your favorite aunt lies sick on the other side of town. Rather than brave the highways to visit her, you move her into your apartment building and just ride the elevator up.
Keywords
Chip scale packaging; Earthquakes;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.2010.5434837
Filename
5434837
Link To Document