• DocumentCode
    144765
  • Title

    Identification of thermoset resin cure kinetics using DSC and genetic algorithm

  • Author

    Jiing-Kae Wu ; Jyun-Ping Huang ; Shevtsov, Stepan ; Chinchan, Levon

  • Author_Institution
    Dept. of Marine Eng., Nat. Kaohsiung Marine Univ., Kaohsiung, Taiwan
  • Volume
    2
  • fYear
    2014
  • fDate
    26-28 April 2014
  • Firstpage
    1204
  • Lastpage
    1208
  • Abstract
    Resin transfer molding (RTM) is the widely used composite material manufacturing process that produces high-strength and lightweight parts for various industrial applications. In order to manufacture defect-free parts with consistent material properties, it is important to control process parameters throughout the entire volume of the molded part. The main difficulty in the large composite parts manufacturing is unobservability of the state of material during cure process. So, model based control that use coupled models of kinetics resin cure and heat transfer in the cured composite part is the good mean to implement a controllability of RTM process. Due to a variety of newly developed components for thermoset resins used in different aircraft, navy and other industrial applications, the new kinetics models, which can satisfactory describe all stages of the resin phase transformation and evolved exothermal heat, should be developed to synthesis of the proper control law. The highlight of this work is using of genetic algorithm to identify eight parameters of new kinetic equation that was proposed to describe the complicated two stage kinetics curves experimentally obtained at the differential scanning calorimetry (DSC) of new thermoset resin developed by Formosa Plastics Co. (Taiwan) for high performance CFRP composites.
  • Keywords
    composite materials; curing; differential scanning calorimetry; genetic algorithms; heat transfer; resins; transfer moulding; CFRP composites; DSC; Formosa Plastics Corporation; RTM; curing; defect-free parts; differential scanning calorimetry; exothermal heat; genetic algorithm; heat transfer; resin transfer molding; thermoset resin cure kinetics; Equations; Genetic algorithms; Heating; Kinetic theory; Mathematical model; Resins; Composite material; Curing process; Genetic algorithm; Kinetic equations; Resin parameters identification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Science, Electronics and Electrical Engineering (ISEEE), 2014 International Conference on
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4799-3196-5
  • Type

    conf

  • DOI
    10.1109/InfoSEEE.2014.6947861
  • Filename
    6947861