Title :
Reverse Nested Miller Compensation Using Current Buffers in a Three-Stage LDO
Author :
Garimella, Annajirao ; Rashid, M. Wasequr ; Furth, Paul M.
Author_Institution :
Klipsch Sch. of Electr. & Comput. Eng., New Mexico State Univ., Las Cruces, NM, USA
fDate :
4/1/2010 12:00:00 AM
Abstract :
A novel frequency compensation scheme called reverse nested Miller compensation using current buffers (RNMCCB) for three-stage amplifiers is proposed. As opposed to previous reverse nested schemes, our work uses inverting gain stages for both the second and third stages. The outer compensation loop utilizes a current mirror as an inverting current buffer (CB), and the inner loop uses a common-gate amplifier as a CB, creating two left-half-plane (LHP) zeros. We introduce a simple and effective method of placing a resistor in series with a CB for accurate placement of LHP zeros. As a design example of the RNMCCB scheme, we propose a three-stage low dropout voltage regulator (LDO) in a 0.5-??m CMOS process to supply 1.21 V to a load ranging from 1 ??A to 100 mA. Our design goals were to simultaneously achieve very high current efficiency and very low transient output voltage variation. As such, we achieved a 99.95% current efficiency and a maximum load transient output voltage variation of ??48 mV with an output capacitor of 100 nF. Experimental results, in good agreement with theoretical analysis, validate the novel RNMCCB frequency compensation scheme.
Keywords :
CMOS integrated circuits; amplifiers; buffer circuits; voltage regulators; CMOS process; common-gate amplifier; current 1 muA to 100 mA; current buffer; frequency compensation; low dropout voltage regulator; reverse nested Miller compensation; size 0.5 micron; three-stage LDO; three-stage amplifier; transient output voltage variation; voltage 1.21 V; Cascode compensation; current buffers (CBs); low dropout voltage regulators (LDO); multistage amplifiers; nested Miller compensation (NMC); reverse NMC (RNMC);
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2010.2043401