Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages

Author

Ponchak, George E. ; Chun, Donghoon ; Yook, Jong-Gwan ; Katehi, Linda P B

Author_Institution

Electron Devices Technol. Branch, NASA Glenn Res. Center, Cleveland, OH, USA

Volume

24

Issue

1

fYear

2001

fDate

2/1/2001 12:00:00 AM

Firstpage

76

Lastpage

80

Abstract

Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line

Keywords

ceramic packaging; crosstalk; finite element analysis; microstrip lines; shielding; 3-D-FEM simulations; LTCC packages; adjacent microstrip lines; attenuation characteristics; circuit performance; crosstalk control; dense RF packages; low temperature cofired ceramic; metal filled via hole fences; shielding structures; Attenuation; Circuit optimization; Circuit simulation; Coupling circuits; Degradation; Electromagnetic coupling; Microstrip; Packaging; Radio frequency; Strips;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.909628

Filename

909628