DocumentCode :
1455298
Title :
Breakdown of gate oxides during irradiation with heavy ions
Author :
Johnston, A.H. ; Swift, G.M. ; Miyahira, T. ; Edmonds, L.D.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Volume :
45
Issue :
6
fYear :
1998
fDate :
12/1/1998 12:00:00 AM
Firstpage :
2500
Lastpage :
2508
Abstract :
Breakdown of thin gate oxides from heavy ions is investigated using capacitor test structures. Soft breakdown was observed for 45 Å oxides, but not for 75 Å oxides. Lower critical fields were observed when experiments were done with high fluences during each successive step. This implies that oxide defects play an important role in breakdown from heavy ions and that breakdown occurs more readily when an ion strike occurs close to a defect site. Critical fields for 75 Å oxides are low enough to allow gate rupture to occur at normal supply voltages for ions with high LET
Keywords :
MOS capacitors; MOS integrated circuits; VLSI; dielectric thin films; ion beam effects; semiconductor device breakdown; 45 to 75 A; capacitor test structures; critical fields; gate oxide brakedown; heavy ion irradiation; oxide defects; soft breakdown; thin gate oxides; Breakdown voltage; Capacitors; Circuit testing; Digital circuits; Electric breakdown; Laboratories; MOSFETs; Propulsion; Space technology; Very large scale integration;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.736491
Filename :
736491
Link To Document :
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