DocumentCode :
1460394
Title :
Test structure design for the evaluation of carrier-carrier scattering effect on hole and electron mobilities
Author :
Persiano, Giovanni Vito ; Bellone, Salvatore
Author_Institution :
Dept. of Inf. & Electr. Eng., Salerno Univ., Italy
Volume :
10
Issue :
2
fYear :
1997
fDate :
5/1/1997 12:00:00 AM
Firstpage :
219
Lastpage :
227
Abstract :
In this paper we present a new three-terminal test structure that enables one to simply evaluate the reduction in the hole and electron mobilities due to the carrier-carrier scattering effect. The use of a three-terminal device is necessary to remove the limitations of other measurement methods and to separately obtain μn and μ p. An investigation of the role of the geometrical parameters of the test structure highlights its suitability and flexibility for the mobility extraction procedure. Numerical simulation is used to carefully design the test structure and to verify the accuracy of the measurement method. Experimental results obtained from n-type silicon regions are presented and compared to major analytical models
Keywords :
electric variables measurement; electron mobility; hole mobility; semiconductor device testing; Si; carrier-carrier scattering effect; electron mobilities; geometrical parameters; hole mobilities; measurement method; mobility extraction procedure; n-type Si regions; numerical simulation; test structure design; three-terminal test structure; Charge carrier processes; Doping; Electron mobility; Impurities; Numerical simulation; Optical scattering; Particle scattering; Silicon; Temperature dependence; Testing;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.572071
Filename :
572071
Link To Document :
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