• DocumentCode
    1464579
  • Title

    Arc restrikes yielding back-commutations in the contact gap of low voltage interrupters

  • Author

    Gauster, Ewald ; Rieder, Werner

  • Author_Institution
    Institute of Switching Devices and High Voltage Technology, Technical University of Vienna, Vienna 1040, Austria
  • Volume
    21
  • Issue
    4
  • fYear
    1998
  • Firstpage
    549
  • Lastpage
    555
  • Abstract
    Arc commutation from the arc chute back into the contact gap of a low voltage circuit-breaker caused by a high arc voltage pulse due to arc splitting was investigated in a model interrupter with the aid of a synthetic test method. In the experiment a well defined time after the arc left the contacts a high voltage ramp was applied across the contact gap. The criterion considered was the breakdown value of the voltage. Recovery time (in the range of 500 μs to 2 ms), geometry and materials of contacts (Cu, Ag/C, Ag/Ni, Ag/MeO) and walls (nongassing and gassing) were varied. Increasing recovery time increased the breakdown voltage significantly due to the decrease of the temperature in the contact area. The minimum breakdown value corresponded to the instantaneous reignition voltage. An increase of the wall distance caused an insignificant increase of the breakdown voltage due to the decrease of field distortion. Gassing wall materials caused slightly higher breakdown voltages than nongassing walls. Increasing contact gap from 2 mm to 4 mm increased the breakdown voltage. No influence was observed at lower (1.5 mm) and at higher contact gaps up to 7 mm. The influence of the contact material was generally little; Cu contacts yielded insubstantially lower breakdown voltages than the other contact materials investigated.
  • Keywords
    cooling; finite element analysis; plastic packaging; temperature distribution; thermal management (packaging); PSGA package; boundary condition; compact dynamic thermal model; cooling; finite element method; frequency response; junction temperature profile; polymer stud grid array; resistor/capacitor network; thermal mass; Boundary conditions; Capacitors; Cooling; Finite element methods; Network synthesis; Packaging; Resistors; Temperature; Thermal expansion; Thermal resistance; Arc-wall interaction; back-commutation; contact material; magnet-blast interrupters; switching arc;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.740047
  • Filename
    740047