Title :
Effects of Electrical Characteristics on the Non-Rectangular Gate Structure Variations for the Multifinger MOSFETs
Author :
Park, Chulhyun ; Song, Youngkyu ; Kang, Jung Han ; Jung, Seong-Ook ; Yun, Ilgu
Author_Institution :
Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
fDate :
3/1/2011 12:00:00 AM
Abstract :
In this paper, modeling methodology of electrical characteristics for non-rectangular gate structured multifinger metal-oxide-semiconductor field-effect transistors based on minimum channel length is proposed. The test structures are fabricated and the parasitic model parameters are extracted using the measured data for the proposed model. The proposed model can support better physical explanation than the previously presented integrated length model. The proposed model can precisely explain the electrical characteristics and is supported by theoretical equations for non-rectangular gates, such as the threshold voltage, the saturation voltage, the saturation current, and the leakage current. However, the previous integrated length model cannot sufficiently explain the electrical characteristics for non-rectangular gates although it is sustained by theoretical equations. Furthermore, this paper shows the relationship between gate poly area and the electrical characteristics. As a result, the electrical characteristics are dependent on the variation of the minimum of the gate length, rather than the profile of gate length variation.
Keywords :
MOSFET; leakage currents; electrical characteristic effects; gate length variation; leakage current; metal-oxide-semiconductor field-effect transistors; minimum channel length; multifinger MOSFET; nonrectangular gate structure variations; parasitic model parameters; saturation current; saturation voltage; Data models; Integrated circuit modeling; Leakage current; Logic gates; Mathematical model; Threshold voltage; Characteristic fluctuation; large-signal modeling; multifinger MOSFET; non-rectangular gate;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2010.2099532