DocumentCode :
1471459
Title :
Effective excursion detection by defect type grouping in in-line inspection and classification
Author :
Shindo, Wataru ; Wang, Eric H. ; Akella, Ramakrishna ; Strojwas, Andrzej J. ; Tomlinson, Wanda ; Bartholomew, Richard
Author_Institution :
Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan
Volume :
12
Issue :
1
fYear :
1999
fDate :
2/1/1999 12:00:00 AM
Firstpage :
3
Lastpage :
10
Abstract :
In this paper, a new methodology for effective process excursion monitoring using defect review/classification information is proposed. We introduce a new defect classification scheme, in which relevant defect types that are likely to be caused by the same mechanism or source are grouped into a “defect family”. It is demonstrated that trending by the defect family drastically improves the detection efficiency of killer defect excursion by reducing or eliminating noise resulting from irrelevant benign defects. We compare the risks of missing critical excursions for monitoring by total defect count, killer defect count, and killer defect family, and illustrate the effectiveness of our methodology using data from actual fabline
Keywords :
inspection; integrated circuit manufacture; process monitoring; semiconductor counters; IC manufacture; defect classification; defect type grouping; detection efficiency; excursion detection; in-line inspection; killer defect count; killer defect family; process excursion monitoring; relevant defect types; total defect count; Control charts; Delay; Inspection; Manufacturing processes; Monitoring; Noise reduction; Optical losses; Quality management; Semiconductor device manufacture; Semiconductor device noise;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.744513
Filename :
744513
Link To Document :
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