DocumentCode :
1473537
Title :
Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
Author :
Wong, C.P. ; Bollampally, Raja S.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
22
Issue :
1
fYear :
1999
fDate :
2/1/1999 12:00:00 AM
Firstpage :
54
Lastpage :
59
Abstract :
Thermal management plays a very vital role in the packaging of high performance electronic devices. Effective heat dissipation is crucial to enhance the performance and reliability of the packaged devices. Liquid encapsulants used for glob top, potting, and underfilling applications can strongly influence the package heat dissipation. Unlike molding compounds, the filler loading in these encapsulants is restrained. This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. A comparative study on the effect of different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant is presented
Keywords :
cooling; encapsulation; reliability; thermal conductivity; thermal management (packaging); electronic packaging; filler loading; glob top; heat dissipation; liquid encapsulants; potting; reliability; thermal conductivity; thermal management; thermally conductive fillers; underfilling applications; Ceramics; Conducting materials; Electronic packaging thermal management; Flip chip; Semiconductor device packaging; Silicon compounds; Thermal conductivity; Thermal loading; Thermal management; Thermal resistance;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.746543
Filename :
746543
Link To Document :
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