Properties of Ag-Cu alloy substrate for Y-Ba-Cu-O superconducting tape

Author

Yoshino, H. ; Kubota, H. ; Yamazaki, M. ; Thanh, T.D. ; Kudo, Y.

Author_Institution

Corp. Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan

Volume

11

Issue

1

fYear

2001

fDate

3/1/2001 12:00:00 AM

Firstpage

3142

Lastpage

3145

Abstract

Textured structure, surface morphology and tensile strength of Ag-Cu alloy tapes and Ag-Cu/Ni alloy clad tapes are studied by using XRD, pole figure, SEM and AFM. An addition of Cu was effective for improving surface smoothness; (210)<120> textured structure, on which YBCO film aligns in-plane, was obtained in Ag-Cu tape. Clad tapes which have 2-4 times higher proof stress 60.2 than pure Ag at 700°C were obtained. These clad tapes are expected to be useful for obtaining low-cost and high-J_c YBCO superconducting tape

Keywords

X-ray diffraction; atomic force microscopy; barium compounds; copper alloys; critical current density (superconductivity); crystal orientation; heat treatment; high-temperature superconductors; scanning electron microscopy; silver alloys; substrates; superconducting tapes; surface texture; surface topography; tensile strength; yttrium compounds; (210)<120> textured structure; 7090 degC; AFM; Ag-Cu; Ag-Cu alloy substrate; Ag-Cu/Ni alloy clad tapes; Ni; SEM; XRD; Y-Ba-Cu-O; pole figure; proof stress; superconducting tape; surface morphology; surface smoothness; tensile strength; textured structure; Heat treatment; Nickel alloys; Pulsed laser deposition; Stress; Superconducting films; Surface morphology; Surface texture; Surface treatment; Temperature; Yttrium barium copper oxide;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.919729

Filename

919729