Title :
A 3-chamber deposition system for the simultaneous double-sided coating of 5-inch wafers
Author :
Geerk, J. ; Zaitsev, A. ; Linker, G. ; Aidam, R. ; Schneider, R. ; Ratzel, F. ; Fromknecht, R. ; Scheerer, B. ; Reiner, H. ; Gagnidze, E. ; Schwab, R.
Author_Institution :
Inst. fur Festkorperphysik, Forschungszentrum Karlsruhe, Germany
fDate :
3/1/2001 12:00:00 AM
Abstract :
We describe a sputtering system which allows the simultaneous deposition of HTS films on both sides of wafers up to 5-inch diameter. The system consists of three deposition chambers in a row to cover a wafer on both sides simultaneously with three different films, such as a buffer layer, a HTS film and a contact layer. We present data on the performance of the system, such as temperature homogeneity at the substrate location, the lateral distribution in film thickness and composition, and the properties of the deposited HTS films, on which we measured the critical current density, the field dependence of the surface resistance and the performance of stripline and disk resonators and filters
Keywords :
barium compounds; critical current density (superconductivity); high-temperature superconductors; sputter deposition; strip line filters; strip line resonators; superconducting microwave devices; superconducting resonators; superconducting thin films; surface conductivity; yttrium compounds; 3-chamber deposition system; 5-inch wafers; YBaCuO; contact layer; critical current density; disk resonators; film composition; film thickness; filters; simultaneous double-sided coating; sputtering; stripline; surface resistance; temperature homogeneity; Buffer layers; Current measurement; Density measurement; Electrical resistance measurement; High temperature superconductors; Sputtering; Substrates; Surface resistance; Temperature dependence; Temperature distribution;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
