DocumentCode :
1480533
Title :
High- Q Integrated CMOS-MEMS Resonators With Deep-Submicrometer Gaps and Quasi-Linear Frequency Tuning
Author :
Chen, Wen-Chien ; Fang, Weileun ; Li, Sheng-Shian
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume :
21
Issue :
3
fYear :
2012
fDate :
6/1/2012 12:00:00 AM
Firstpage :
688
Lastpage :
701
Abstract :
Integrated CMOS-MEMS free-free beam resonators using pull-in mechanism to enable deep-submicrometer electrode- to-resonator gap spacing without interference in their mechanical boundary conditions (BCs) have been demonstrated simultaneously with low motional impedance and high Q. The key to attaining high Q relies on a decoupling design between pull-in frames for gap reduction and mechanical BCs of resonators. In addition, the use of metal-SiO2 composite structures has been proved to greatly benefit the thermal stability of CMOS-MEMS resonators. Furthermore, tuning electrodes underneath pull-in frames were designed to offer “quasi-linear” frequency tuning capability where linear relationship between tuning voltage and frequency was achieved. In this paper, CMOS-MEMS free-free beam resonators with gap spacings of 110, 210, and 275 nm, respectively, were tested under direct one-port measurement in vacuum, demonstrating a resonator Q greater than 2000 and a motional impedance as low as 112 kΩ and, at the same time, allowing quasi-linear frequency tuning to achieve a total tuning range of 5000 ppm and a sensitivity of 83.3 ppm/V at 11.5 MHz with zero dc power consumption. Such a resonator monolithically integrated with a CMOS amplifier, totally occupying a die area of only 300 μm × 130 μm, was also tested with enhanced performance, benefiting future timing reference and RF synthesizing applications.
Keywords :
CMOS integrated circuits; amplifiers; circuit tuning; low-power electronics; micromechanical resonators; silicon compounds; CMOS amplifier; SiO2; dc power consumption; deep-submicrometer gaps; free-free beam resonators; gap reduction; high-Q integrated CMOS-MEMS resonators; mechanical boundary conditions; monolithic integration; pull-in mechanism; quasilinear frequency tuning; thermal stability; tuning electrodes; Electrodes; Frequency modulation; Impedance; Metals; Resonant frequency; Thermal stability; Tuning; CMOS-MEMS; Capacitive transduction; RF-MEMS; frequency tuning; micromechanical resonator; monolithic integration; temperature compensation;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2012.2189360
Filename :
6176182
Link To Document :
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