DocumentCode :
1480821
Title :
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Author :
Cho, Jonghyun ; Song, Eakhwan ; Yoon, Kihyun ; Pak, Jun So ; Kim, Joohee ; Lee, Woojin ; Song, Taigon ; Kim, Kiyeong ; Lee, Junho ; Lee, Hyungdong ; Park, Kunwoo ; Yang, Seungtaek ; Suh, Minsuk ; Byun, Kwangyoo ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng., KAIST (Korea Adv. Inst. of Sci. & Technol.), Daejeon, South Korea
Volume :
1
Issue :
2
fYear :
2011
Firstpage :
220
Lastpage :
233
Abstract :
In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from a TSV. It is important to estimate the TSV noise transfer function and manage the noise-tolerance budget in the design of a reliable 3D-IC system. In this paper, a TSV noise coupling model is proposed based on a three-dimensional transmission line matrix method (3D-TLM). Using the proposed TSV noise coupling model, the noise transfer functions from TSV to TSV and TSV to the active circuit can be precisely estimated in complicated 3D structures, including TSVs, active circuits, and shielding structures such as guard rings. To validate the proposed model, a test vehicle was fabricated using the Hynix via-last TSV process. The proposed model was successfully verified by frequency- and time-domain measurements. Additionally, a noise isolation technique in 3D-IC using a guard ring structure is proposed. The proposed noise isolation technique was also experimentally demonstrated; it provided -17 dB and -10dB of noise isolation between the TSV and an active circuit at 100 MHz and 1 GHz, respectively.
Keywords :
frequency-domain analysis; integrated circuit design; integrated circuit modelling; interference suppression; shielding; three-dimensional integrated circuits; time-domain analysis; transmission line matrix methods; Hynix via-last TSV process; TSV noise transfer function; active circuit; frequency 1 GHz; frequency 100 MHz; frequency-domain measurements; guard ring; noise coupling; noise suppression; noise-tolerance; shielding structures; three-dimensional integrated circuit; three-dimensional transmission line matrix; through-silicon via; time-domain measurements; Couplings; Integrated circuit modeling; Mathematical model; Noise; Silicon; Substrates; Through-silicon vias; Guard ring; measurement; noise coupling model; noise coupling suppression; noise isolation; noise transfer function; shielding structure; substrate noise; three-dimensional integrated circuit (3D-IC); through-silicon via (TSV);
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2010.2101892
Filename :
5739017
Link To Document :
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