Title :
A DOST based approach for the condition monitoring of 11 kV distribution line insulators
Author :
Reddy, M. Jaya Bharata ; Chandra, B. Karthik ; Mohanta, D.K.
Author_Institution :
Dept. of EEE, Nat. Inst. of Technol., Tiruchirappalli, India
fDate :
4/1/2011 12:00:00 AM
Abstract :
The diminishing trend of reliability owing to possible power system failures has become a serious concern for the power system as a whole. It has necessitated the development of advanced protection methodologies employing advanced information technology and substation monitoring system (SMS) constitutes an integral part of such methodologies. The proposed scheme for condition monitoring of insulators, which serves as an augmented feature of SMS, aims at alleviating overall system reliability as well as power quality because cracked insulators cause disruption of power, thereby incurring heavy loss to the power system utilities. The image processing based video surveillance (VS) is incorporated to dispense with the cumbersome and time consuming conventional manual on-site detection using discrete orthogonal S-transform (DOST) in conjunction with some intelligent classification algorithms to ascertain the condition of the insulators.
Keywords :
condition monitoring; image processing; insulators; power distribution lines; power distribution reliability; power supply quality; substations; video surveillance; advanced information technology; condition monitoring; cracked insulators; discrete orthogonal S-transform; distribution line insulators; image processing; intelligent classification; power quality; power system failures; reliability; substation monitoring system; video surveillance; voltage 11 kV; Adaptive systems; Cameras; Classification algorithms; Feature extraction; Inspection; Insulators; Monitoring; Distribution automation system (DAS); K-means clustering; adaptive neuro-fuzzy inference system (ANFIS); discrete orthogonal S-Transform (DOST); substation monitoring system (SMS); video surveillance;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2011.5739465