• DocumentCode
    148695
  • Title

    Welcome to ICEP 2014

  • Author

    Ishizuka, Masaru

  • Author_Institution
    Toyama Prefectural University, Japan
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    We welcome you to the International Conference on Electronics Packaging (ICEP) 2014, the largest and premier international conference on electronics packaging in Japan, to be held from April 23rd to 25th at the Toyama International Conference Center in Toyama, Japan.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama, Japan
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826645
  • Filename
    6826645
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=148695