Title :
Sequence-pair approach for rectilinear module placement
Author :
Xu, Jin ; Guo, Pei-Ning ; Cheng, Chung-Kuan
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
fDate :
4/1/1999 12:00:00 AM
Abstract :
With the recent advent of deep sub-micron technology and new packaging schemes such as multichip modules, integrated circuit components are often not rectangular. Most existing block placement approaches, however, only deal with rectangular blocks, resulting in inefficient area utilization. New approaches which can handle arbitrarily shaped blocks are essential to achieve high-performance design. In this paper, we extend the sequence-pair approach for rectangular block placement to arbitrarily sized and shaped rectilinear blocks. Experimental results show that our algorithm achieves results with excellent area utilization
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; multichip modules; arbitrarily shaped blocks; area utilization; deep submicron technology; integrated circuit components; multichip modules; rectilinear module placement; sequence-pair approach; Circuit simulation; Circuit testing; Genetics; Graphics; Integrated circuit packaging; Integrated circuit technology; Iterative algorithms; Multichip modules; Simulated annealing; Very large scale integration;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on