Effects of Ar plasma and Ar fast atom bombardment (FAB) treatments on Cu/polymer hybrid surface for wafer bonding

Author

Ran He ; Suga, Takashi

Author_Institution

Dept. of Precision Eng., Univ. of Tokyo, Tokyo, Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

78

Lastpage

81

Abstract

Cu/polymer hybrid surface was treated by Ar plasma and Ar fast atom bombardment to confirm the feasibility of Cu/polymer hybrid bonding by using surface activated bonding method. Uncross-linked novolac resin mixed with imidazole as the curing agent was used as the polymer adhesive. We used X-ray photoelectron spectroscopy to study the effects of Ar plasma and Ar FAB treatments on the Cu/polymer surface. It was shown that Ar FAB could remove Cu native oxides on Cu surface efficiently rather than Ar plasma. Cu contamination on polymer surface was present after surface treatment, which is due to Cu ion adsorption on polymer surface during the Cu/polymer hybrid surface treating process.

Keywords

X-ray photoelectron spectra; argon; copper; curing; plasma applications; resins; surface contamination; surface treatment; wafer bonding; Ar; Cu; FAB treatments; X-ray photoelectron spectroscopy; contamination; curing agent; fast atom bombardment treatments; imidazole; ion adsorption; plasma treatments; polymer adhesive; polymer hybrid surface treating process; surface activated bonding method; uncross-linked novolac resin; wafer bonding; Bonding; Plasma temperature; Polymers; Silicon; Surface contamination; Surface treatment; 3D packaging; Cu/polymer hybrid bonding; Wafer bonding; surface activated bonding (SAB);

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826665

Filename

6826665