The fine pitch Cu-pillar bump interconnect technology utilizing NCP resin, achieving the high quality and reliability

In the field of high-end server or network systems, the Flip Chip Ball Grid Array (FCBGA) package has been applied to achieve high performance on the device for data processing. And recently, global IT network and cloud markets, which require high-speed data processing, are rapidly expanding, so that further development of FCBGA package with high performance is strongly needed to realize such market demands. This time, we have developed Flip Chip technology with very fine pitch of 30 um staggered pitch Cu-pillar Bump, utilizing Non Conductive Paste (NCP) resin to adapt to high pin count device including high-speed signal interface. The keys of this flip chip technology are to optimize the condition of the reaction of NCP resin under the die and the phenomena of solder melting for interconnection. And, in order to confirm of the level of package reliability, the effectiveness of the height of solder joints was studied. The above technology and reliability is reported on this paper.