• DocumentCode
    1489864
  • Title

    IEEE Components, Packaging, and Manufacturing Technology Society information for authors

  • Volume
    32
  • Issue
    1
  • fYear
    2009
  • Abstract
    Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2008.2012105
  • Filename
    5272832
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1489864