• DocumentCode
    1490141
  • Title

    Silicon piezoresistive stress sensors and their application in electronic packaging

  • Author

    Suhling, Jeffrey C. ; Jaeger, Richard C.

  • Author_Institution
    Aurban University
  • Volume
    1
  • Issue
    1
  • fYear
    2001
  • fDate
    6/1/2001 12:00:00 AM
  • Firstpage
    14
  • Lastpage
    30
  • Keywords
    Circuit testing; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Lead; Piezoresistance; Semiconductor device packaging; Silicon; Temperature sensors; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2001.923584
  • Filename
    923584
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1490141