• DocumentCode
    1490480
  • Title

    Molecular dynamics simulations of plasma crystal formation including wake effects

  • Author

    Hammerberg, James E. ; Lemons, D.S. ; Murillo, Michael S. ; Winske, Dan

  • Author_Institution
    Los Alamos Nat. Lab., NM, USA
  • Volume
    29
  • Issue
    2
  • fYear
    2001
  • fDate
    4/1/2001 12:00:00 AM
  • Firstpage
    247
  • Lastpage
    255
  • Abstract
    Molecular dynamics (MD) simulations are used to study dusty plasma crystal formation in three dimensions. The grain interaction model includes a spherically symmetric Debye-Huckel potential, an asymmetric wake potential, and a unidirectional external potential representing gravity and the sheath potential. We use a new form for the wake with ion-neutral collisions that reduce the interaction length of the wake. For the parameters considered, we obtain quasi-ordered structures in which the grains align into well-formed strings in the vertical direction and a more amorphous alignment of the strings themselves. Changes in the vertical alignment as a function of the wake parameters are analyzed
  • Keywords
    dusty plasmas; molecular dynamics method; plasma collision processes; plasma flow; plasma sheaths; plasma simulation; amorphous alignment; asymmetric wake potential; crystallisation; dusty plasma crystal formation; grain alignment; grain interaction model; gravity; ion-neutral collisions; molecular dynamics simulations; plasma crystal formation; quasi-ordered structures; sheath potential; spherically symmetric Debye-Huckel potential; strongly coupled plasma; three dimensional process; unidirectional external potential; vertical alignment; vertical direction; wake effects; wake interaction length; wake parameters; well-formed strings; Amorphous materials; Crystallization; Dusty plasma; Electrodes; Gravity; Numerical simulation; Plasma measurements; Plasma sheaths; Plasma simulation; Plasma temperature;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.923702
  • Filename
    923702